Senior Flip Chip Engineer - (US-CA-San Jose - 95196)

Minimum Education: Bachelors
Job Type: Full Time
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Report to Senior Manager, Packaging Development: Experience engineer who will take ownership of specific equipment and processes in our prototype development lab to develop next generation flip chip packaging. This individual should have a thorough understanding of the typical operation of the equipment and processes as well as the extreme limits. This position requires a hands on individual as you will be responsible for recipe creation and development, establishing process controls, tool qualifications and documenting results. The ideal candidate will have 5 – 10 years of experience in semi conductor packaging with expertise in one or more of the following areas: Flip Chip Die Attach or Flip Chip Underfill

JOB RESPONSIBILITIES:
· Hands on lead engineer who will identify, assess and develop materials and processes for flip chip attach and underfill for large microprocessor type packages.
· Work closely with design and reliability engineers on packaging development, assembly process optimization and reliability assessment.
· Plan and execute experiments to determine material interactions and impact of thermal, electrical, mechanical stresses on performance, yield and reliability.
· Develop packaging technology for commercialization based on knowledge for high value assembly techniques and materials.
· Determine failure mechanisms related to materials and processes utilizing analytical techniques.
· Write and present technical reports on research and development activities, process and materials specifications, and internal failure analysis reports.
· Provide guidance during technology transfer to development partners and licenses.

CRITICAL SKILLS, KNOWLEDGE AND ABILITIES:
· Demonstrated expertise in developing advanced packaging and processing strategies for flip chip packaging – preferably for large micro processor die.
· Ability to assess the capability of a package design to meet stringent performance and reliability requirements by conducting DOE in conjunction with rigorous analysis.
· In depth understanding of various failure mechanisms of devices and packages. These include solder fatigue, intermetallic formation, fracture mechanics, and electro/chemical migration.
· Understanding of a variety of analytical techniques such as SEM/EDX, DSC, TMA, ASM, FTIR to characterize material properties and perform failure analysis.
· Proficient understanding of metal, ceramic and polymer material properties and their behaviors in relation to electronics package reliability.
· Knowledge of advanced thermal management materials and strategies.
· Use of decision making and problem solving tools including structured problem solving, design of experiments, fish bone charts, failure mode and effect analysis and statistical analysis techniques.
· Ability to be an independent, creative thinker to solve cutting edge technical challenges.
· Excellent written and verbal communication skills together with demonstrated ability to successfully manage development projects.

EDUCATION: Degree in mechanical engineering, materials science, physics,
chemistry or related discipline.