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CAREER SUMMARY
20 years experience in the semiconductor industry providing process
engineering support in both manufacturing and research and development
environments. Very hands-on and collaborate well with both equipment
maintenance and operations.
WORK EXPERIENCE
Staff Engineer (Etch), Jireh Semiconductor | Hillsboro, OR
05/12 - 07/14
. Responsible for oxide, metal etch and outgoing wafer quality control.
. Backup engineer on CD and film thickness metrology, poly Si etch, ash,
solvent strip and wet etch processes.
. Developed and implemented optimized in-situ wafered and waferless
cleans to improve oxide etcher mean time between cleans and reduce
defectivity.
. Implemented endpointed etch processes to improve process repeatability
and tool capacity.
. Reviewed inline SPC charts and equipment down issues daily. Reviewed
and evaluated electrical parametric data as required to insure process
stability.
Staff Engineer (Yield), ON Semiconductor, Gresham, OR
10/10 - 05/12
. Responsible for edge engineering including chips, breaks and scratches
and standardization of defect trends across all technologies.
. Evaluated defectivity trends real time and recommended tool/process
restrictions and engineering involvement when warranted.
. Updated defect database and educated technicians on expedient
determination of likely defect source during a process excursion. Main
backup contact for all in-fab defect issues.
Senior Process Engineer (Etch), Maxim Integrated Products | Beaverton, OR
05/04 - 10/10
. Responsible for oxide etch and metal etch on Performed ongoing
projects to reduce inline and end of line scraps, improve inline and
parametric CPKs, increase tool utilization and availability.
. Involved in projects to optimize existing processes and process
development for new device integration.
Field Service Engineer, Tokyo Electron America | Hillsboro, OR
01/03 - 05/04
. Responsible for maintenance, troubleshooting and repair of TEL Unity
II and Telius SCCM etchers.
. Tracking of MTBF, root cause analysis, critical spares and setup a
troubleshooting database.
Chemistry Instructor, Portland Community College | Portland, OR
09/02 - 04/03
. Responsible for teaching general chemistry and laboratory instruction.
Sr. Process Engineer (litho&etch), Integrated Device Technology |
Hillsboro, OR 06/97-10/01
Litho:
. Responsible for CD metrology and maintenance of dark field layers.
. Oversaw a resist conversion project to improve process latitude and
reduce costs.
Etch:
. Responsible for ash and wet etch/strips.
. Evaluated and implemented ash reduction to reduce costs.
. Optimized solvent strips to reduce defectivity and improve tool
utilization.
. Provided additional support to oxide, poly and metal etch modules.
Lithography Process Engineer, Nortel | Ottawa, Ontario, Canada
01/95 - 05/97
Optoelectronics
Advanced Processing group
. Responsible for the development and demonstration of a 0.1 um grating
printing and etch process for InP DFB laser array fabrication.
. Evaluated phase shift masks for both conventional and surface emitting
DFB laser arrays.
. Designed and modified a contact aligner for off-axis illumination of
phase shift masks.
. Evaluated a commercial holographic aligner for DFB laser array (0.1um)
and SAW device (0.25um) lithography.
. Evaluated and implemented a new resist with BARC process to increase
yields on discrete DFB lasers.
Development Engineer, Nortel | Ottawa, Ontario, Canada 01/92 -
12/94
Silicon Components Group.
. Responsible for patterning of ferroelectric related materials by wet
and dry etching and lift-off techniques.
. Evaluated and purchased a plasma etcher for patterning ferroelectrics.
. Designed a test mask set to evaluate the integration of ferroelectrics
onto Si ICs for NV-DRAM and on-chip de/coupling capacitors.
. Prepared precursor solutions and characterized spin-on techniques to
prepare films of ferroelectric PZT, conducting Ruthenium dioxide and
inorganic resist/H2 barrier materials.
. Studied the effect of substrate preparation and solution composition
on electroless copper deposition.
SKILLS
Experienced with LAM 9600/DFM metal etchers, LAM 4400/4520/XL, TEL UnityM
and AMAT Centura oxide etchers, AMAT P5000 and DPS poly etchers, Mattson,
Aura 1000 and 2000, Axcelis, Gasonics 3510 and ULVAC ashers, Semitool acid
and solvent tools, AME 8115, Tegal 904e, AMAT MarkII, MxP+ and DPS metal
and LRC Alliance, SEZ single wafer wet etch and Wet sinks. Experienced with
Opal and Hitachi CD SEMs, Tencor UV1050, Thermawave 2600/5200, ASML, GCA
and Canon steppers and SVG & DNS tracks, KLA 2139, Tencor AIT1, Rudolph
August AXI Macro inspection tool, JEOL SEMs and KLA-Tencor eV300. Knowledge
of Kaizen(6 sigma), lean manufacturing, DOE and SPC.
EDUCATION
Ph.D. Chemistry Carleton University, Ottawa, ON, CANADA, 1996
Thesis title - "Photoinduced Electron Transfer in Chromophore-Quencher
Complexes Designed for Metal Centered Chemistry" Thesis Supervisor - Dr.
R. J. Crutchley
B.S. Chemistry, Carleton University, Ottawa, ON, CANADA, 1986
Graduated with High Honours
PATENTS
Maxim: 7,966,722
Nortel: 6,337,032; 6,066,581; 5,728,603 and 5,358,889
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