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Research Assistant Resume Boulder, CO
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Title research assistant
Target Location US-CO-Boulder
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                                                      Candidate's Name
Department of Mechanical Engineering,                                                     Phone: PHONE NUMBER AVAILABLE
University of Colorado, Boulder, CO, Street Address  9                                               Email:EMAIL AVAILABLE


SUMMARY
       Proficient in ANSYS (Multiphysics&Icepak), Origins, AutoCAD, L-Edit, Clewin, C, Matlab, Fortran,
         Mathematica, Solidworks
       Solid background in heat transfer, finite element analysis, fluid mechanics, and material mechanics
       Excellent communication skills, team-player
       Expert in temperature measurements, data acquisition, cleanroom tech, SEM, coating, soldering, and shop
         skills


EDUCATION
  Ph.D. in Mechanical Engineering                                                                                  2014
  Dept. of Mechanical Eng., University of Colorado-Boulder, Boulder, CO                                       GPA: 3.87
  Thesis Title: Enhancing Phase-Change Heat Transfer with Copper Nanowire-Structured Surfaces
  M. S. in Mechanical Engineering,                                                                                 2009
  Inst. of Eng. Therm. Chinese Acad. of Sci., Beijing, China
  B.S. in Thermal Science and Energy Engineering,                                                                  2006
  Univ. of Sci. and Tech. of China (USTC), Hefei, China


COURSEWORK
   Heat Transfer, Micro Scale Heat transfer, Finite Element Analysi s (Structure Analysis), Computational Heat
   Transfer, Computational Fluid Dynamics, Fluid Dynamics, Thermodynamics, Micro -Electro-Mechanical System,
   Material Mechanics


PROFESSIONAL EXPERIENCE
  Research Assistant, with Prof. Ronggui Yang                                                         08/2009-12/2014
   University of Colorado, Boulder
    Built FEA models with ANSYS to determine the thermal performance of flat heat pipe (FHP), revealing the
       potential applications of FHP in high acceleration condition and mobile devices.
    Determined a heat spreading structure for GaN high frequency RF device with ANSYS, useful for hot spot
       cooling.
    Developed high-temperature/vacuum experiment systems to study enhanced pool boiling and dropwise
       condensation heat transfer on nanowire structured surfaces, enabling highly efficient apparatus with ultrahigh
       heat flux removal capability.
    Designed and fabricated patterned nanowire-array wicking structures for thermal ground planes capable to
       remove ~200W/cm2 heat flux, beneficial for thermal management of energy concentrated electronic devices.
  Research Assistant, with Prof. Dawei Tang                                                           12/2006-07/2009
   Institute of Engineering Thermophysics, Chinese Academy of Sciences
    Measured and modeled thermal properties of carbon nanotube arrays using the 3 method for future thermal
       interface material applications.
    Wrote C language code to simulate the travelling of shock wave inside a tunnel, revealing the formation of Mach
       stem and the interaction of shock waves.
  Research Assistant, with Prof. Jianhua Wang                                                       09/2005-07/2006
   University of Science and Technology of China
    Set up an experiment system to measure the velocity of complex internal flow with Particle Image Velocimetry
      and studied the flow field with Fluent, providing gas flow improvement suggestions in a nozzle material.


HONORS
  Winner, ASME IMECE Micro/Nano Technology Forum Travel Grant, San Diego, California, U.S.A.                     2013
  Best Presentation, GEAR2S Symposium, University of Colorado, Boulder                                           2013
  Deans Outstanding Merit Fellowship, University of Colorado, Boulder                                           2009
  Excellent Graduate Award, University of Science and Technology of China                                        2006
  Scholarships for Academic Excellence, University of Science and Technology of China                      2003-2005


JOURNAL PUBLICATIONS
1. Q. Li, W. Wang, C. Oshman, B. Latour, C. Li, V. Bright, Y.-C. Lee, R. Yang, Hierarchical Micro/Nano- Structured
   Surfaces for Boiling Heat Transfer Enhancement, to be submitted
2. Q. Li, W. Wang, M. Tian, R. Yang, High Heat Flux Thermal Ground Planes with Patterned Nanowire Array
   Wicking Structures, to be submitted
3. Q. Li, J. Wu, G. Wu, R. Yang, Dropwise Condensation Enhancement on Hydrophobic Nanowired Surfaces,  to be
   submitted
4. C. Oshman, Q. Li, L.-A. Liew, R. Yang, Y.-C. Lee, V. Bright, Flat Flexible Polymer Heat Pipes, Journal of
   Micromechanics and Microengineering, Vol. 23, pp. 015001(1)-(6) 2013
5. C. Oshman, Q. Li, L.-A. Liew, R. Yang, Y.-C. Lee, V. Bright, D. Sharar, N. Jankowski, B. Morgan, Thermal
   Performance of a Flat Polymer Heat Pipe Heat Spreader under High Acceleration , Journal of Micromechanics and
   Microengineering, Vol. 22, pp. 045018(1)-(12) 2012
6. Q. Li, D. Tang, et al., Measurement of Longitudinal Thermal Conductivity of a Vertically Grown Carbon
   NanoTubes Array on a Quartz Substrate, Journal of Engineering Thermophysics, Vol. 31(1), 2010
7. Q. Li, J. Wang, et al., An Investigation of Coolant Flow Performance within Laminated Plate (I Visualization of
   Complex Flow Field Using PIV Technology), Journal of Experiments in Fluid Mechanics, Vol. 0(4), 2007


CONFERENCES
1. Q. Li, W. Wang, C. Oshman, B. Latour, C. Li, H. Li, V. Bright, Y.-C. Lee, G. Peterson, R. Yang, Enhanced Pool
   Boiling on Micro-, Nano-, and Hybrid-Structured Surfaces (IMECE2011-64921), ASME 2011 International
   Mechanical Engineering Congress & Exposition (IMECE2011), Denver, CO, 2011
2. Q. Li, W. Wang, M. Tian, R. Yang, High Heat Flux Thermal Ground Planes with Patterned Copper Nanowired
   Wicking Structures (HT2013-17674), ASME 2013 Summer Heat Transfer Conference, Minneapolis, MN, 2013
3. Q. Li, J. Wu, G. Wu, R. Yang, Dropwise Condensation Enhancement on Hydrophobic Nanowired Surfaces
   (IMECE2013-66447), ASME 2013 International Mechanical Engineering Congress & Exposition (IMECE2013),
   San Diego, CA, 2013

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