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Mechanical Engineer Electronics Packaging
Location:
US-OH-Dayton
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MUST HAVE: Electronics Packaging, Environmental Testing (DO-160, Mil 810), Aerospace, ANSYS, Siemens NX

Job Description:

Ability to perform stress, fatigue, thermal and vibration finite element analyses using ANSYS software including Icepak

Experience in the packaging of high temperature and high power electronics modules

Experience in thermal materials and solutions

Experience in aerospace component design and packaging

Ability to perform tolerance stackups and experience with GD&T

Experience in design for shock and high vibration environments per DO160 or Mil 810

Experience in commercial certification or qualification regimes of aerospace products

Strong interpersonal and leadership skills

Ability to write test procedures and test reports

Understanding of Design for Manufacturing including manufacturing cost and reproducibility

Experience with Unigraphics (NX)

Inherent Technologies

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