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MUST HAVE: Electronics Packaging, Environmental Testing (DO-160, Mil 810), Aerospace, ANSYS, Siemens NX
Job Description:
Ability to perform stress, fatigue, thermal and vibration finite element analyses using ANSYS software including Icepak
Experience in the packaging of high temperature and high power electronics modules
Experience in thermal materials and solutions
Experience in aerospace component design and packaging
Ability to perform tolerance stackups and experience with GD&T
Experience in design for shock and high vibration environments per DO160 or Mil 810
Experience in commercial certification or qualification regimes of aerospace products
Strong interpersonal and leadership skills
Ability to write test procedures and test reports
Understanding of Design for Manufacturing including manufacturing cost and reproducibility
Experience with Unigraphics (NX)
Inherent Technologies