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Skills:Principal Scientist, Research & Development, Wafer Level Processing, Semiconductor Fab, Wafer-level Metrology, Thin Film Analysis, Wafer Spin-coating, Lithographic Patterning, Inspection Equipment, GBPL, 6 Sigma

Experience level:Mid-senior

Experience required:10 Years

Education level:Bachelors degree

Job function:Research

Industry:Chemicals

Total position:1

Responsibilities:

• Applications engineer specializing in wafer-level processing techniques, comfortable with exploring advanced/non-standard methods for unique applications.
• Adept at hands-on lab work, creative thinking, problem solving in a unique and fast-paced applications engineering laboratory environment.

• Serve as technical contact point for project workflows based mainly in fabrication, such as lamination, coatings, lithography, and cure techniques.
• Support additional prototyping applications development initiatives relevant to strategic goals as they arrive.
• Create, maintain, and leverage close relationships with internal and external metrology and analysis collaborators to drive characterization and performance data collection and analysis.
• Basic data analysis and statistics experience is expected.
• Clearly and concisely communicate research to team members of varying technical backgrounds.

• Demonstrate ability to work cross functionally and globally with personnel at multiple levels.
• Maintain appropriate focus on personal and process safety, product integrity, and environmental stewardship.

Requirements

Skills/Capabilities:

Required

• B.S. degree in engineering, material science or chemistry.

• Industrial experience with clean room + wafer level processing methods & tools.
• 5-15+ years hands-on industrial experience in semiconductor fab environment.
• Familiarity with material characterization, wafer-level metrology and/or thin film analysis.
• Well-organized, detail-oriented, and results-driven team player.
• Good written and verbal communication skills.

• English fluency.

Strongly preferred:

• Masters degree in engineering, material science or chemistry.
• Experience performing semiconductor industry lithography processes, including wafer spin-coating, lithographic patterning + developing.
• Expertise with a diverse range of analytical equipment: Chemical, mechanical, thermal analysis.

• Basic materials characterization.
• Inspection equipment (confocal microscopes, scanning electron microscopes).
• Curiosity and excitement to learn beyond assignments, excellent problem-solving skills.
• Applications testing for quality control and reliability testing for material process qualification and QC release.
• Competency in problem solving and statistical DOE data analysis for optimization and quality control in support of customer qualification.

• Hands-on experience in and enthusiasm for wafer-level or panel-level material formulation.

Qualifications:

• Education: B.S. degree in engineering, material science or chemistry.
• 5+ years of industrial experience is desirable.
• GBPL or other 6 Sigma training is desirable.

• Previous cross-functional or global project experience is desirable.

Must Haves:

• B.S. degree in engineering, material science or chemistry.

• Industrial experience with clean room + wafer level processing methods & tools.
• 5-15+ years hands-on industrial experience in semiconductor fab environment.
• Hands-on experience in and enthusiasm for wafer-level or panel-level material formulation.
• Experience performing semiconductor industry lithography processes, including wafer spin-coating, lithographic patterning + developing.
• Expertise with a diverse range of analytical equipment: Chemical, mechanical, thermal analysis.

• Basic materials characterization.
• Inspection equipment (confocal microscopes, scanning electron microscopes).

Nice to Haves:

• 5+ years of industrial experience is desirable.
• Masters degree in engineering, material science or chemistry.

• GBPL or other 6 Sigma training is desirable.
• Previous cross-functional or global project experience is desirable.