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This position is in our semiconductor IC Package area in Santa Rosa, California. We manufacture integrated circuit packages in support of our internal and external customers. You will be part of a team that processes IC packages through trim/leak test and IC testing and will work closely with engineering, maintenance and other operators.

Though you will be part of a team, you will be working independently to actively achieve the output and quality goals set for the area. The scope and complexity of your work will be based on your existing knowledge and capabilities as well as how fast you can acquire new skills. In package test area operators have several job tasks including preparing parts for testing by trimming leads, testing the quality of a package seal and setting semi-automated machines to test the electrical integrity of a part prior to packaging for shipment.

Must

• • The ability to work in an ESD environment
  • Experience with MS Suite of applications including Outlook, Excel, and Word
  • The ability to work in a multi-disciplined, cross-departmental environment
  • Demonstrated ability with small packages, substrates and handling chips.
  • Experience with many aspects of integrated circuit fabrication processing including but not limited to Package testing, Trim and Form, leak testing and visual inspection desired
  • Desire to be part of a team that requires rapid skill development and progressively increased responsibility.
  • Flexible schedule for training
  • Desire to maintain high quality production
  • Good verbal and written communication skills
  • The ability to multi-task is essential
  • Technical experience preferred. (Electronics testing, troubleshooting, etc.)